RIE and Plasma Cleaning

RIE and Plasma Cleaning
Reactive Ion Etching (RIE) is a sophisticated technique used for etching semiconductor materials with high resolution. RIE is a key enabling technology allowing semiconductor features to continue to approach the range of a few nanometres. This technology is also widely used as a machining process for nano and micro scale devices, which enable the development of MEMS and NEMS based sensor and device fabrication. Reactive ion etching process use glow discharge plasma, which generates radicals, fragmented molecules and ions of precursor gases, which etch the substrate surface primarily by chemical reactions. The chemical process can be supported by additional physical etching process to facilitate anisotropic etch.

HHV Reactive Ion Etch tool offers a wide range of cost effective material processes to R&D in the electronic, industrial and medical sectors. It uses a well proven design-providing ease of use, with excellent process management enabling to prepare superior quality devices.