CT150 PECVD Tool

CT150 PECVD Tool

Cluster PECVD tool for R&D

CT150 is a cluster tool for the deposition of silicon layer for thin film & Hetro-junction Intrinsic Thin layer (HIT) solar cells, metals, metal oxides, metal nitrides, dielectrics, and other materials for nanotechnology applications.

CT150 has four process chambers for different PECVD & PVD processes. Substrate handling is provided by magnetically-coupled transfer arms with options for automation.








  • Deposition of amorphous and microcrystalline silicon based doped, un-doped, and its alloy materials
  • Individual process chamber connected to central transfer / isolation chamber along with entry / exit load lock connected to transfer chamber.
  • Substrate transfer : magnetic arm or robot
  • Substrate size up to 300 mm x 300 mm
  • Horizontal deposition
  • Semi / fully automatic
  • Power source : VHF / RF
  • Substrate temperature up to 250 deg C